Electronics are indispensable, but their environmental cost is staggering. Traditional circuit board materials, often derived from fossil fuels, contribute to pollution and waste. Researchers from Johannes Kepler University have recently published research on an innovative alternative: mycelium skins. These biodegradable substrates, derived from fungi, promise to transform the way we design and recycle electronics.
Photograph of a bent NFC-tag demonstrating the flexibility of mycelium-based PCBs
Plastic consumption surpassed 400 million tonnes globally in 2022, yet less than 9% was recycled. This dependency on non-renewable materials, combined with limited recycling, exacerbates waste issues. Mycelium, the root-like structure of fungi, offers a compelling solution, thanks to its ability to upcycle agricultural waste into versatile materials.
Using Ganoderma lucidum, a wood-degrading fungus, the team cultivated mycelium skins on beechwood waste. By harvesting early in the growth phase, they achieved a smooth, homogenous surface—a prerequisite for thin-film electronics. However, untreated mycelium was too rough and inconsistent for practical use.
To enhance its properties, researchers employed chemical treatments, deacetylating chitin into chitosan. This process strengthened the material, reduced surface roughness to 2.7 micrometres, and preserved its biodegradability. Additionally, thermal stability tests confirmed that the skins could endure up to 250°C, making them viable for soldering electronic components.
The mycelium skins were coated with a biodegradable shellac layer, further smoothing the surface and improving resistance to moisture. The team then laminated a thin copper layer onto the treated skins, enabling the creation of flexible circuit boards. These circuits maintained high conductivity, even after 10,000 bending cycles.
Recycle-able mycelium PCB laminated with copper foil.
To demonstrate real-world applications, the researchers developed a Near-Field Communication (NFC) tag. This device remained functional after months of use, showcasing the potential of mycelium-based electronics for practical deployment.
One of the standout features of these mycelium skins is their recyclability. Mounted electronic components can be recovered by dissolving the shellac adhesive in ethanol, allowing the mycelium substrate to be reused or composted. This innovation aligns with circular economy principles, reducing electronic waste while enabling material recovery.
This breakthrough highlights the potential of mycelium as a platform for eco-friendly electronics. By combining advanced material engineering with a focus on biodegradability, mycelium-based substrates could redefine the future of electronic design, manufacturing, and recycling.